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Qualcomm Unveils Snapdragon X Plus: AI 45 TOPS!

2024-04-25 Mr.Ming

On the evening of April 24th, Qualcomm announced the release of its innovative AI PC chip, Snapdragon X Plus. This chip builds upon the performance of the Snapdragon X Elite, offering enhanced power efficiency while delivering superior performance compared to ARM and x86 competitors. It also features the strongest AI capabilities in the PC market.

Snapdragon X Plus is built with advanced 4nm process technology, setting a new standard in the traditional PC market. It is powered by Qualcomm's Oryon CPU, which includes 10 custom high-performance cores running at up to 3.4 GHz with a total cache of 42 MB. The CPU performance surpasses Apple's M3 by 10%.

In multi-threaded Geekbench tests, Snapdragon X Plus outperforms Intel's Core Ultra 7 155H. At the same peak performance, it consumes 54% less power than comparable options. The integrated Adreno GPU offers 3.8 TFLOPS of computing power and supports three external 4K 60Hz displays and HDR10.

In WildLife Extreme testing, Snapdragon X Plus's GPU performance outshines Intel's Core Ultra 7 155H by up to 36% at the same power consumption, achieving peak performance with only half the power usage.

The chip's overall efficiency extends battery life significantly, with tests showing up to 40% longer battery life in Office 365, 58% longer in web browsing, 89% longer in YouTube streaming, and more than double the duration in Teams video calls compared to the Intel Core Ultra 7 155H.

Snapdragon X Plus also maintains an exceptional 45 TOPS of NPU computing power, the highest in the PC industry globally. This supports productivity and peripheral functions, including real-time code generation during software development, and enhances image quality, AI filters, and AI noise reduction.

For connectivity, Snapdragon X Plus supports Wi-Fi 7, high-frequency concurrent multiple connections, Sub-6GHz, and mmWave, with 5G speeds reaching up to 10 GB/s.

Additionally, Snapdragon X Plus will soon support Snapdragon Seamless, facilitating seamless connectivity between devices using Qualcomm chips, such as smartphones, PCs, XR terminals, wearables, and audio devices. This ecosystem integration mirrors the seamless connectivity experience offered by Apple's ecosystem and provides Qualcomm with a notable competitive advantage.

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