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On September 16, MediaTek announced that its first flagship system-on-chip (SoC) built on TSMC's 2nm process has successfully completed tape-out, with mass production and market release expected by the end of 2026.

MediaTek highlighted that TSMC's 2nm process introduces nanosheet transistor structures, delivering superior performance, power efficiency, and yield. Compared with TSMC's existing N3E process, the enhanced 2nm technology increases logic density by 1.2×, boosts performance by up to 18% at the same power, and reduces power consumption by around 36% at the same speed.

The company emphasized that its ongoing collaboration with TSMC spans flagship mobile platforms, computing, automotive, and data center applications, aiming to create chipsets that balance high performance with energy efficiency. This latest milestone underscores the strong partnership between MediaTek and TSMC.

Joe Chen, MediaTek's President and COO, said, “Developing a chip using TSMC's 2nm process showcases our ability to leverage cutting-edge semiconductor technology across a wide range of devices and applications. Our long-standing collaboration with TSMC ensures that MediaTek flagship products deliver top-tier performance and efficiency, bringing exceptional solutions from edge to cloud.”

Dr. Kevin Zhang, TSMC's Senior Vice President of Business Development and Global Sales, and Deputy Co-COO, added, “TSMC's 2nm technology marks a significant step into the nanosheet era, reflecting our relentless efforts to meet customer demands. Our ongoing partnership with MediaTek aims to maximize performance and energy efficiency across diverse applications.”

While MediaTek has not officially confirmed the product, industry speculation points to the next-generation Dimensity 9 series flagship—likely the Dimensity 9600.