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According to the latest supply chain reports, Apple is rapidly expanding its in-house chip portfolio, moving beyond core SoCs to cover more supporting components. TSMC's cutting-edge process technology continues to play a critical role behind this shift.

Next year's iPhone 18 Pro models are expected to debut Apple's self-developed C2 modem chip alongside the A20 chip built on TSMC's 2nm process. At the same time, the upcoming MacBook M6 processor and Vision Pro's R2 chip are also likely to adopt the same 2nm technology.

This move highlights Apple's deeper reliance on TSMC's advanced nodes. Sources note that the iPhone Air launched this year already integrates the processor, modem, and WiFi chip, while the iPhone 18 series will push integration further with Apple's own modem solutions.

To support this growing demand, TSMC is scaling its 2nm production capacity, aiming to reach 40,000 wafers by the end of this year and nearly 100,000 wafers by 2026. In addition, its WMCM advanced packaging capacity is set to rise to 70,000–80,000 units by late 2026, mainly through upgrades to existing InFO packaging lines.

Industry experts highlight that the 2nm GAA transistor architecture offers a more attractive cost structure, with similar EUV layer counts as 3nm, making adoption more appealing to clients. Analysts are optimistic that 2nm ramp-up will outpace 3nm in its first year, with TSMC expected to see double-digit revenue contributions from this node as early as next year. Despite currency headwinds, TSMC's upcoming Q3 earnings are projected to beat forecasts, reinforcing confidence in its leadership at the forefront of semiconductor innovation.