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W25Q128JVSIM: Features, Specs & More

2025-11-04 Mr.Ming

In the fast-evolving world of electronics, reliable memory solutions are essential. The Winbond W25Q128JVSIM is a NOR Flash memory chip designed for high-performance serial applications. It offers industrial-grade endurance, versatile interface options, and compact packaging, making it ideal for embedded systems, IoT devices, and consumer electronics. In this comprehensive article, we'll delve into the intricacies of the W25Q128JVSIM, uncovering its definition, key features, specifications, applications, and a closer look at its manufacturer.

 

Catalog

W25Q128JVSIM's Overview

Key Features

Specifications

Applications

W25Q128JVSIM's Manufacturer

Conclusion

 

W25Q128JVSIM's Overview

The W25Q128JVSIM is a NOR Flash memory chip manufactured by Winbond Electronics Corporation. It supports serial communication through SPI, Dual SPI, and Quad SPI interfaces. The chip operates on a low voltage of 2.7V to 3.6V and offers 128M-bit storage, making it ideal for storing firmware, boot code, and embedded system data. Its industrial-grade temperature range ensures reliable operation under demanding conditions.

 

Key Features

Let's delve into the standout features that make the W25Q128JVSIM a standout in the world of electronics:

· The chip uses NOR cell architecture for fast read access.

· It has a 128M-bit density with 16M x 8 organization.

· W25Q128JVSIM supports SPI, Dual SPI, and Quad SPI interfaces.

· The device operates at a maximum frequency of 133 MHz.

· It offers a maximum access time of 6ns for high-speed performance.

· The memory includes 4K-byte sectors with 256-byte page size.

· The chip supports programmability with up to 100,000 endurance cycles.

· Its operating temperature ranges from -40°C to 85°C, suitable for industrial applications.

· The device comes in an 8-pin SOIC surface mount package.

· Winbond ensures command compatibility and industrial-grade quality.

 

Specifications

Now, let's take a closer look at the technical specifications that define the capabilities of the W25Q128JVSIM:

Type

Parameter

Cell Type

NOR

Chip Density (bit)

128M

Architecture

Sectored

Boot Block

No

Block Organization

Symmetrical

Address Bus Width (bit)

24

Sector Size

4Kbyte x 4096

Page Size

256byte

Number of Bits/Word (bit)

8

Number of Words

16M

Programmability

Yes

Timing Type

Synchronous

Max. Access Time (ns)

6

Maximum Erase Time (S)

200/Chip

Maximum Programming Time (ms)

3/Page

Process Technology

58nm

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Maximum Operating Frequency (MHz)

133

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

25

Program Current (mA)

25

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000

Packaging

Tube

Mounting

Surface Mount

Package Height

1.8 mm

Package Width

5.28 mm

Package Length

5.28 mm

PCB changed

8

Standard Package Name

SO

Supplier Package

SOIC

Pin Count

8

Lead Shape

Gull-wing

 * W25Q128JVSIM's Datasheet

 

Applications

The W25Q128JVSIM is widely used across multiple industries:

· It is ideal for embedded systems requiring reliable non-volatile memory.

· The chip is commonly used in consumer electronics, including smart devices and wearables.

· It is suitable for industrial automation where high endurance is essential.

· The memory supports firmware storage in IoT devices.

· W25Q128JVSIM enables data logging applications in harsh temperature environments.

 

W25Q128JVSIM's Manufacturer

Winbond Electronics Corporation is a Taiwan-based corporation founded in 1987. It's a Specialty memory IC company. It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house.

 

Conclusion

The Winbond W25Q128JVSIM is a robust and versatile NOR Flash memory chip, offering high speed, industrial-grade endurance, and multiple SPI interfaces. Its combination of low voltage operation, fast access times, and reliable packaging makes it a go-to choice for engineers designing high-performance embedded systems. Whether for consumer devices, industrial control, or IoT applications, the W25Q128JVSIM provides both performance and reliability.

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